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Item Name | Semiconductor Devices Unitized |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5961 Semiconductor Devices and Associated Hardware |
National Item Identification Number (NIIN) | 01-245-3669 (012453669) |
NCB Code | USA (01) |
Manufacturer | Boeing Company The, Northrop Grumman Systems Corporation, American Microsemiconductor Inc, Fairchild Semiconductor Corp, National Semiconductor Corporation, General Dynamics Land Systems Inc, Freescale Semiconductor Inc |
Part Number | Manufacturer | Item Name | RFQ |
---|---|---|---|
HS5058-1001 | boeing company the | semiconductor devices unitized | RFQ |
44-038313-01 | northrop grumman systems corporation | semiconductor devices unitized | RFQ |
839233-0012 | northrop grumman systems corporation | semiconductor devices unitized | RFQ |
MHQ3467HXV | american microsemiconductor inc | semiconductor devices unitized | RFQ |
SA2738 | fairchild semiconductor corp | semiconductor devices unitized | RFQ |
44-054259-01 | northrop grumman systems corporation | semiconductor devices unitized | RFQ |
FPQ3467 | fairchild semiconductor corp | semiconductor devices unitized | RFQ |
DH3467CD-883B | national semiconductor corporation | semiconductor devices unitized | RFQ |
DH3467D 883 | national semiconductor corporation | semiconductor devices unitized | RFQ |
DH3467CN | national semiconductor corporation | semiconductor devices unitized | RFQ |
DH3467D-MIL | national semiconductor corporation | semiconductor devices unitized | RFQ |
7568204-001 | general dynamics land systems inc | semiconductor devices unitized | RFQ |
MHQ3467HXV | freescale semiconductor inc | semiconductor devices unitized | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | CERAMIC |
ABHP | OVERALL LENGTH | 0.785 INCHES MAXIMUM |
ABKW | OVERALL HEIGHT | 0.200 INCHES MAXIMUM |
ABMK | OVERALL WIDTH | 0.325 INCHES MAXIMUM |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-116 |
ASKA | COMPONENT NAME AND QUANTITY | 4 TRANSISTOR |
AXGY | MOUNTING METHOD | PRESS FIT |
CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED CASE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL TRANSISTOR |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | -40.0 MAXIMUM COLLECTOR TO EMITTER VOLTAGE,DC ALL TRANSISTOR AND-40.0 MAXIMUM COLLECTOR TO BASE VOLTAGE,DC ALL TRANSISTOR AND-5.0 MAXIMUM EMITTER TO BASE VOLTAGE,DC ALL TRANSISTOR |
CTQX | CURRENT RATING PER CHARACTERISTIC | -1.00 AMPERES SOURCE CUTOFF CURRENT MAXIMUM ALL TRANSISTOR |
CTRD | POWER RATING PER CHARACTERISTIC | 6.3 WATTS SMALL-SIGNAL INPUT POWER,COMMON-COLLECTOR ABSOLUTE ALL TRANSISTOR |
CTRK | TRANSFER RATIO | 20.0 MINIMUM STATIC FORWARD CURRENT TRANSFER RATIO,COMMON-EMITTER ALL TRANSISTOR |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS AMBIENT AIR |
FEAT | SPECIAL FEATURES | ALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: PNP |
TTQY | TERMINAL TYPE AND QUANTITY | 14 UNINSULATED WIRE LEAD |
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