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Item Name | Semiconductor Device Diode |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5961 Semiconductor Devices and Associated Hardware |
National Item Identification Number (NIIN) | 01-350-1245 (013501245) |
NCB Code | USA (01) |
Manufacturer | Sdi Inc, Cobham Advanced Electronic Solutions Inc, Aai Corporation |
Part Number | Manufacturer | Item Name | RFQ |
---|---|---|---|
DP05072-000 | sdi inc | semiconductor device diode | RFQ |
DR05072-000 | cobham advanced electronic solutions inc | semiconductor device diode | RFQ |
61205-90066 | aai corporation | semiconductor device diode | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
CTRD | POWER RATING PER CHARACTERISTIC | 200.0 MILLIWATTS MAXIMUM COLLECTOR POWER DISSIPATION |
ABHP | OVERALL LENGTH | 0.016 INCHES NOMINAL |
CBBL | FEATURES PROVIDED | MOUNTING PAD |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MINIMUM BREAKDOWN VOLTAGE,DC |
CTQX | CURRENT RATING PER CHARACTERISTIC | 10.00 MICROAMPERES MAXIMUM REVERSE CURRENT,DC |
ABMK | OVERALL WIDTH | 0.016 INCHES NOMINAL |
AFZC | FUNCTION FOR WHICH DESIGNED | SWITCHING |
AXGY | MOUNTING METHOD | PRESS FIT |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 85.0 DEG CELSIUS AMBIENT AIR |
FEAT | SPECIAL FEATURES | THE DIODE SHALL BE CAPABLE OF FULFILLING ALL REQUIREMENTS WHEN ATTACHED TO A GOLD PLATED ALUMINUM GROUND PLANE USING A CONDUCTIVE SILVER FILLED EPOXY; JUNCTION PATTERN ARRANGEMENT: PN |
PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACES GOLD |
TTQY | TERMINAL TYPE AND QUANTITY | 1 BONDING PAD |
ABKW | OVERALL HEIGHT | 0.005 INCHES MINIMUM AND 0.008 INCHES MAXIMUM |
CTRG | CAPACITANCE RATING IN PICOFARADS | 0.1 MAXIMUM |
MATT | MATERIAL | SILICON SEMICONDUCTOR |
PRMT | PRECIOUS MATERIAL | GOLD |
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