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| Item Name | Microcircuit Linear |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 00-117-4574 (001174574) |
| NCB Code | USA (00) |
| Manufacturer | National Semiconductor Corporation, Epcos Ag, Fairchild Semiconductor Corp, Lacon Electronic Gmbh, Raytheon Company, Adelco Elektronik Gmbh, Ford Aerospace Corp, Freescale Semiconductor Inc, Gilbert Engineering Co Inc, Northrop Grumman Systems Corporation, Lockheed Martin Corporation, General Dynamics Advanced |
| Part Number | Manufacturer | Item Name | RFQ |
|---|---|---|---|
| LM709H | national semiconductor corporation | microcircuit linear | RFQ |
| Q67000A179F11 | epcos ag | microcircuit linear | RFQ |
| U5B770931 | fairchild semiconductor corp | microcircuit linear | RFQ |
| MC1709GA | lacon electronic gmbh | microcircuit linear | RFQ |
| RM709T | raytheon company | microcircuit linear | RFQ |
| MC1709GA | adelco elektronik gmbh | microcircuit linear | RFQ |
| RM709TA | adelco elektronik gmbh | microcircuit linear | RFQ |
| PA7709-31 | ford aerospace corp | microcircuit linear | RFQ |
| MC1709G | freescale semiconductor inc | microcircuit linear | RFQ |
| RM709T | fairchild semiconductor corp | microcircuit linear | RFQ |
| T0A1709 | gilbert engineering co inc | microcircuit linear | RFQ |
| 990C241H01 | northrop grumman systems corporation | microcircuit linear | RFQ |
| 1712066 | lockheed martin corporation | microcircuit linear | RFQ |
| RM709TA | lacon electronic gmbh | microcircuit linear | RFQ |
| 02-804831-1 | general dynamics advanced | microcircuit linear | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAR | BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND HIGH GAIN AND LOW LEVEL AND LOW POWER AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND EXTERNALLY COMPENSATED |
| CQSJ | INCLOSURE MATERIAL | GLASS AND METAL |
| CQSZ | INCLOSURE CONFIGURATION | CAN |
| CQZP | INPUT CIRCUIT PATTERN | 4 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT |
| Relevant Components for NSN - 5962-00-117-4574, 5962001174574 | ||||
| 5998-01-628-9128 (5998016289128) | 5950-00-556-2628 (5950005562628) | 5910-00-502-7030 (5910005027030) | 5930-01-200-1187 (5930012001187) | |
| 5930-00-436-0040 (5930004360040) | 5998-01-022-6777 (5998010226777) | 5999-01-229-2868 (5999012292868) | 5930-00-451-8223 (5930004518223) | |
| 5980-01-237-3545 (5980012373545) | 5955-00-463-6952 (5955004636952) | 5975-01-438-5116 (5975014385116) | 5998-01-391-1476 (5998013911476) | |
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