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Item Name | Microcircuit Memory |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-033-2288 (010332288) |
NCB Code | USA (01) |
Manufacturer | Intersil Corporation, Sierra Ic Inc, Northrop Grumman Systems Corporation, Harris Corporation, Drs Network And Imaging Systems Llc, Raytheon E Systems Inc, Intersil Communications Inc |
Part Number | Manufacturer | Item Name | RFQ |
---|---|---|---|
CD40103BF 3A | intersil corporation | microcircuit memory | RFQ |
CD40103BF 3 | intersil corporation | microcircuit memory | RFQ |
3512 830 06831 | sierra ic inc | microcircuit memory | RFQ |
134693-1 | northrop grumman systems corporation | microcircuit memory | RFQ |
CD40103BD | harris corporation | microcircuit memory | RFQ |
232 53-1918 | drs network and imaging systems llc | microcircuit memory | RFQ |
MC-A1103-001 | raytheon e systems inc | microcircuit memory | RFQ |
CD40103BF 3 | intersil communications inc | microcircuit memory | RFQ |
CD40103BD 3 | intersil corporation | microcircuit memory | RFQ |
CD40103BF 3A | intersil communications inc | microcircuit memory | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.095 INCHES MINIMUM AND 0.140 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | COUNTERMEASURES SET TYPE AN/ALQ-17A FSCM 72314 |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND MEDIUM SPEED AND ASYNCHRONOUS AND PRESETTABLE AND SYNCHRONOUS AND W/ENABLE AND W/CLEAR |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 8 STAGE |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | -0-001-AE JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 20.5 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 81349-MIL-STD-883 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS,BROCHURES,ETC.,THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS,INDUSTRY DIRECTORIES,AND SIMILAR TRADE PUBLICATIONS,REFLECTI |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
Relevant Components for NSN - 5962-01-033-2288, 5962010332288 | ||||
5998-01-628-9128 (5998016289128) | 5950-00-556-2628 (5950005562628) | 5910-00-502-7030 (5910005027030) | 5930-01-200-1187 (5930012001187) | |
5930-00-436-0040 (5930004360040) | 5998-01-022-6777 (5998010226777) | 5999-01-229-2868 (5999012292868) | 5930-00-451-8223 (5930004518223) | |
5980-01-237-3545 (5980012373545) | 5955-00-463-6952 (5955004636952) | 5975-01-438-5116 (5975014385116) | 5998-01-391-1476 (5998013911476) | |
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