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Item Name | Microcircuit Memory |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-123-4333 (011234333) |
NCB Code | USA (01) |
Manufacturer | Fairchild Semiconductor Corp, Mmi Amd, Dla Land And Maritime, Intersil Corporation, Advanced Micro Devices Inc, Raytheon Company |
Part Number | Manufacturer | Item Name | RFQ |
---|---|---|---|
HR10728 | fairchild semiconductor corp | microcircuit memory | RFQ |
SD948 | mmi amd | microcircuit memory | RFQ |
ROM PROM FAMILY 017 | dla land and maritime | microcircuit memory | RFQ |
93453 | fairchild semiconductor corp | microcircuit memory | RFQ |
B1614-1B | intersil corporation | microcircuit memory | RFQ |
27S33 | advanced micro devices inc | microcircuit memory | RFQ |
HM7643 | intersil corporation | microcircuit memory | RFQ |
5353-1F | mmi amd | microcircuit memory | RFQ |
DH75699 | advanced micro devices inc | microcircuit memory | RFQ |
53S441-F | mmi amd | microcircuit memory | RFQ |
932883-342 | raytheon company | microcircuit memory | RFQ |
B2052-342 | intersil corporation | microcircuit memory | RFQ |
HM9-7643-B2052-342 | intersil corporation | microcircuit memory | RFQ |
HL42543 | fairchild semiconductor corp | microcircuit memory | RFQ |
MM5353 | mmi amd | microcircuit memory | RFQ |
18529 | mmi amd | microcircuit memory | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.355 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.090 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 175.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND BURN IN,MIL-STD-883,CLASS B AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND W/BUFFERED OUTPUT AND 3-STATE OUTPUT |
CQSJ | INCLOSURE MATERIAL | GLASS AND METAL |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 82577-932883 DRAWING (THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
TTQY | TERMINAL TYPE AND QUANTITY | 18 FLAT LEADS |
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5998-01-628-9128 (5998016289128) | 5950-00-556-2628 (5950005562628) | 5910-00-502-7030 (5910005027030) | 5930-01-200-1187 (5930012001187) | |
5930-00-436-0040 (5930004360040) | 5998-01-022-6777 (5998010226777) | 5999-01-229-2868 (5999012292868) | 5930-00-451-8223 (5930004518223) | |
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