Recently Updated NSN 5962-01-184-1162 Or (5962011841162) Part List

Item Name	Microcircuit Memory
Federal Supply Group (FSG)	Electrical and Electronic Equipment Components
Federal Supply Class (FSC)	5962 Microcircuits Electronic
National Item Identification Number (NIIN)	01-184-1162 (011841162)
NCB Code	USA (01)
Manufacturer	Military Specifications, National Semiconductor Corporation, Dla Land And Maritime, Mmi Amd, Lockheed Martin Corporation, Northrop Grumman Systems Corporation, Advanced Micro Devices Inc

Part Number	Manufacturer	Item Name	RFQ
5962-3850303BRX	military specifications	microcircuit memory	RFQ
DMPAL14H4J 883	national semiconductor corporation	microcircuit memory	RFQ
5962-3850303BRA	military specifications	microcircuit memory	RFQ
DMPAL14H4J	national semiconductor corporation	microcircuit memory	RFQ
5962-8103503BRB	dla land and maritime	microcircuit memory	RFQ
81035	dla land and maritime	microcircuit memory	RFQ
ROM-PROM HEAD 060	dla land and maritime	microcircuit memory	RFQ
5962-8103503BRX	dla land and maritime	microcircuit memory	RFQ
PAL14H4MJ	mmi amd	microcircuit memory	RFQ
M38510/50303BRA	military specifications	microcircuit memory	RFQ
8103503RB	dla land and maritime	microcircuit memory	RFQ
PAL14H4	mmi amd	microcircuit memory	RFQ
PAL14H4MJ	national semiconductor corporation	microcircuit memory	RFQ
PAL14H4MJ 883B	national semiconductor corporation	microcircuit memory	RFQ
14H4	mmi amd	microcircuit memory	RFQ
DMPAL14H4MJ 883B	national semiconductor corporation	microcircuit memory	RFQ
7908688-05	lockheed martin corporation	microcircuit memory	RFQ
48-066386-02	northrop grumman systems corporation	microcircuit memory	RFQ
MIL-M-38510/503	military specifications	microcircuit memory	RFQ
PAL14H4	advanced micro devices inc	microcircuit memory	RFQ
M38510/50303BRX	military specifications	microcircuit memory	RFQ
5962-3850303BRB	military specifications	microcircuit memory	RFQ
PAL14H4MJ 883B	mmi amd	microcircuit memory	RFQ

MRC	Criteria	Characteristic
ADAQ	BODY LENGTH	1.060 INCHES MAXIMUM
ADAT	BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
ADAU	BODY HEIGHT	0.185 INCHES MAXIMUM
AEHX	MAXIMUM POWER DISSIPATION RATING	2.0 WATTS
AFGA	OPERATING TEMP RANGE	-55.0/125.0 DEG CELSIUS
AFJQ	STORAGE TEMP RANGE	-65.0/150.0 DEG CELSIUS
CBBL	FEATURES PROVIDED	BIPOLAR AND PROGRAMMABLE AND MONOLITHIC AND HERMETICALLY SEALED
CQSJ	INCLOSURE MATERIAL	CERAMIC
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE
CQWX	OUTPUT LOGIC FORM	BIPOLAR METAL-OXIDE SEMICONDUCTOR
CQZP	INPUT CIRCUIT PATTERN	28 INPUT
CTFT	CASE OUTLINE SOURCE AND DESIGNATOR	D-8 MIL-M-38510
CTQX	CURRENT RATING PER CHARACTERISTIC	100.00 MILLIAMPERES MAXIMUM OUTPUT SINK
CWSG	TERMINAL SURFACE TREATMENT	SOLDER
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.0 VOLTS NOMINAL POWER SOURCE
CZEQ	TIME RATING PER CHACTERISTIC	45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT
CZER	MEMORY DEVICE TYPE	PAL
TEST	TEST DATA DOCUMENT	81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS,BROCHURES,ETC.,THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS,INDUSTRY DIRECTORIES,AND SIMILAR TRADE PUBLICATIONS,REFLECTI
TTQY	TERMINAL TYPE AND QUANTITY	20 PRINTED CIRCUIT
ZZZK	SPECIFICATION/STANDARD DATA	81349-MIL-M-38510/503 GOVERNMENT SPECIFICATION