AS9120B, ISO 9001:2015, and FAA AC 0056B Accredited
| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-188-8743 (011888743) |
| NCB Code | USA (01) |
| Manufacturer | Dla Land And Maritime, Military Specifications, Advanced Micro Devices Inc, Mmi Amd, Bae Systems Inc, Lockheed Martin Corporation, National Semiconductor Corporation |
| Part Number | Manufacturer | Item Name | RFQ |
|---|---|---|---|
| 5962-8983903RA | dla land and maritime | microcircuit memory | RFQ |
| MIL-M-38510/504 | military specifications | microcircuit memory | RFQ |
| 5962-3850402BRX | military specifications | microcircuit memory | RFQ |
| PAL16R8ADMB | advanced micro devices inc | microcircuit memory | RFQ |
| ROM PROM HEAD 048 | dla land and maritime | microcircuit memory | RFQ |
| 5962-3850402BRA | military specifications | microcircuit memory | RFQ |
| M38510/50402BRA | military specifications | microcircuit memory | RFQ |
| PAL 16RA8AMJ 883B | mmi amd | microcircuit memory | RFQ |
| 312396-004 | bae systems inc | microcircuit memory | RFQ |
| 5962-3850402BRB | military specifications | microcircuit memory | RFQ |
| 1983-7194 | lockheed martin corporation | microcircuit memory | RFQ |
| DMPAL16R8A 883B | national semiconductor corporation | microcircuit memory | RFQ |
| PAL16R8A | national semiconductor corporation | microcircuit memory | RFQ |
| PAL16R8-2MJ883B | mmi amd | microcircuit memory | RFQ |
| PAL 16R8A | mmi amd | microcircuit memory | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.060 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.290 INCHES MINIMUM AND 0.320 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 2.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BIPOLAR AND PROGRAMMABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES NOMINAL OUTPUT SINK |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 12.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS,BROCHURES,ETC.,THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS,INDUSTRY DIRECTORIES,AND SIMILAR TRADE PUBLICATIONS,REFLECTI |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
| ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/504 GOVERNMENT SPECIFICATION |
| Relevant Components for NSN - 5962-01-188-8743, 5962011888743 | ||||
| 5998-01-628-9128 (5998016289128) | 5950-00-556-2628 (5950005562628) | 5910-00-502-7030 (5910005027030) | 5930-01-200-1187 (5930012001187) | |
| 5930-00-436-0040 (5930004360040) | 5998-01-022-6777 (5998010226777) | 5999-01-229-2868 (5999012292868) | 5930-00-451-8223 (5930004518223) | |
| 5980-01-237-3545 (5980012373545) | 5955-00-463-6952 (5955004636952) | 5975-01-438-5116 (5975014385116) | 5998-01-391-1476 (5998013911476) | |
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