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Item Name | Microcircuit Memory |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-201-7748 (012017748) |
NCB Code | USA (01) |
Manufacturer | Dla Land And Maritime, Mmi Amd, Bae Systems Inc, Aai Corporation, General Dynamics Mission Systems, Texas Instruments Inc, Lockheed Martin Corporation |
Part Number | Manufacturer | Item Name | RFQ |
---|---|---|---|
8412902LA | dla land and maritime | microcircuit memory | RFQ |
5962-8412902BLB | dla land and maritime | microcircuit memory | RFQ |
ROM PROM FAMILY 064 | dla land and maritime | microcircuit memory | RFQ |
PAL20R8AMJ 883 | mmi amd | microcircuit memory | RFQ |
PAL20R8AMJS-883B | mmi amd | microcircuit memory | RFQ |
8412902LX | dla land and maritime | microcircuit memory | RFQ |
312242-003 | bae systems inc | microcircuit memory | RFQ |
5962-8412902BLX | dla land and maritime | microcircuit memory | RFQ |
8412902LA | mmi amd | microcircuit memory | RFQ |
PAL20R8A | mmi amd | microcircuit memory | RFQ |
5962-8412902BLA | dla land and maritime | microcircuit memory | RFQ |
55898-90267 | aai corporation | microcircuit memory | RFQ |
15-2727349-1 | general dynamics mission systems | microcircuit memory | RFQ |
84129 | dla land and maritime | microcircuit memory | RFQ |
TIBPAL20R8-20MJTB | texas instruments inc | microcircuit memory | RFQ |
TIBPAL20R8-20MJB | texas instruments inc | microcircuit memory | RFQ |
3657-0935 | lockheed martin corporation | microcircuit memory | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | RECEIVING SET AN/ALR56C |
CBBL | FEATURES PROVIDED | BIPOLAR AND PROGRAMMABLE AND MONOLITHIC |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 12.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | PAL |
TEST | TEST DATA DOCUMENT | 14933-84129 DRAWING (THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWIN |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
Relevant Components for NSN - 5962-01-201-7748, 5962012017748 | ||||
5998-01-628-9128 (5998016289128) | 5950-00-556-2628 (5950005562628) | 5910-00-502-7030 (5910005027030) | 5930-01-200-1187 (5930012001187) | |
5930-00-436-0040 (5930004360040) | 5998-01-022-6777 (5998010226777) | 5999-01-229-2868 (5999012292868) | 5930-00-451-8223 (5930004518223) | |
5980-01-237-3545 (5980012373545) | 5955-00-463-6952 (5955004636952) | 5975-01-438-5116 (5975014385116) | 5998-01-391-1476 (5998013911476) | |
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