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| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-262-9858 (012629858) |
| NCB Code | USA (01) |
| Manufacturer | Waferscale Integration Inc, Seeq Technology Inc, Incon Inc, Intel Corporation, Dla Land And Maritime, Texas Instruments Inc, Advanced Micro Devices Inc, Boeing Company The, Philips Semiconductors Ltd, Harris Corporation |
| Part Number | Manufacturer | Item Name | RFQ |
|---|---|---|---|
| WS27C256L-20DMB | waferscale integration inc | microcircuit memory | RFQ |
| DM27C256-200 | seeq technology inc | microcircuit memory | RFQ |
| AM27C256-200DC | incon inc | microcircuit memory | RFQ |
| MD27C256 20 B | intel corporation | microcircuit memory | RFQ |
| 5962-8606301XA | dla land and maritime | microcircuit memory | RFQ |
| 5962-86063 | dla land and maritime | microcircuit memory | RFQ |
| TMS27C256-20 | texas instruments inc | microcircuit memory | RFQ |
| MD27C256 20 B | advanced micro devices inc | microcircuit memory | RFQ |
| SMJ27C256-20JM | texas instruments inc | microcircuit memory | RFQ |
| 477-2872-002 | boeing company the | microcircuit memory | RFQ |
| 5962-8606301XB | dla land and maritime | microcircuit memory | RFQ |
| 27C256-BXA-20 | philips semiconductors ltd | microcircuit memory | RFQ |
| I25-0022-002 | harris corporation | microcircuit memory | RFQ |
| 5962-8606301XX | dla land and maritime | microcircuit memory | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.375 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.500 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 275.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE |
| CQSJ | INCLOSURE MATERIAL | METAL OR CERAMIC OR PLASTIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 23 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.5 VOLTS MAXIMUM INPUT |
| CZER | MEMORY DEVICE TYPE | EPROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| Relevant Components for NSN - 5962-01-262-9858, 5962012629858 | ||||
| 5998-01-628-9128 (5998016289128) | 5950-00-556-2628 (5950005562628) | 5910-00-502-7030 (5910005027030) | 5930-01-200-1187 (5930012001187) | |
| 5930-00-436-0040 (5930004360040) | 5998-01-022-6777 (5998010226777) | 5999-01-229-2868 (5999012292868) | 5930-00-451-8223 (5930004518223) | |
| 5980-01-237-3545 (5980012373545) | 5955-00-463-6952 (5955004636952) | 5975-01-438-5116 (5975014385116) | 5998-01-391-1476 (5998013911476) | |
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