Item Name | Microcircuit Memory |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-320-2539 (013202539) |
NCB Code | USA (01) |
Manufacturer | Bae Systems Controls Inc, Waferscale Integration Inc, Dla Land And Maritime, Atmel Corporation |
Part Number | Manufacturer | Item Name | RFQ |
---|---|---|---|
312A3451P2 | bae systems controls inc | microcircuit memory | RFQ |
57C49B-70CMB | waferscale integration inc | microcircuit memory | RFQ |
WS57C49-70CMB | waferscale integration inc | microcircuit memory | RFQ |
WS57C49C-70CMB | waferscale integration inc | microcircuit memory | RFQ |
5962-87515 | dla land and maritime | microcircuit memory | RFQ |
5962-8751503B3C | dla land and maritime | microcircuit memory | RFQ |
57C49C 70CDMB | waferscale integration inc | microcircuit memory | RFQ |
WS57C49B-70CMB | waferscale integration inc | microcircuit memory | RFQ |
AT27HC641R70LM 883 | atmel corporation | microcircuit memory | RFQ |
5962-8751503B3B | dla land and maritime | microcircuit memory | RFQ |
AT27HC641-70LM 883 | atmel corporation | microcircuit memory | RFQ |
5962-87515033A | dla land and maritime | microcircuit memory | RFQ |
5962-87515033C | dla land and maritime | microcircuit memory | RFQ |
5962-8751503B3X | dla land and maritime | microcircuit memory | RFQ |
AT27HC641-70LMB | atmel corporation | microcircuit memory | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 11.23 MILLIMETERS MINIMUM AND 11.68 MILLIMETERS MAXIMUM |
ADAT | BODY WIDTH | 11.23 MILLIMETERS MINIMUM AND 11.68 MILLIMETERS MAXIMUM |
ADAU | BODY HEIGHT | 1.52 MILLIMETERS MINIMUM AND 2.54 MILLIMETERS MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-4 MIL-M-38510 |
CTQX | CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES MAXIMUM SUPPLY |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | EPROM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
Relevant Components for NSN - 5962-01-320-2539, 5962013202539 | ||||
5998-01-628-9128 (5998016289128) | 5950-00-556-2628 (5950005562628) | 5910-00-502-7030 (5910005027030) | 5930-01-200-1187 (5930012001187) | |
5930-00-436-0040 (5930004360040) | 5998-01-022-6777 (5998010226777) | 5999-01-229-2868 (5999012292868) | 5930-00-451-8223 (5930004518223) | |
5980-01-237-3545 (5980012373545) | 5955-00-463-6952 (5955004636952) | 5975-01-438-5116 (5975014385116) | 5998-01-391-1476 (5998013911476) | |
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