AS9120B, ISO 9001:2015, and FAA AC 0056B Accredited
| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-333-2528 (013332528) |
| NCB Code | USA (01) |
| Manufacturer | Dla Land And Maritime, Waferscale Integration Inc, Nimikkeistokeskus Ncb Finland, Atmel Corporation, Austin Semiconductor Inc, Lockheed Martin Corporation, Microchip Technology Incorporated, Texas Instruments Inc, Advanced Micro Devices Inc |
| Part Number | Manufacturer | Item Name | RFQ |
|---|---|---|---|
| 5962-87648 | dla land and maritime | microcircuit memory | RFQ |
| WS27C512L-20CMB | waferscale integration inc | microcircuit memory | RFQ |
| 5962-8764802YB | dla land and maritime | microcircuit memory | RFQ |
| 10129514 | nimikkeistokeskus ncb finland | microcircuit memory | RFQ |
| 5962-8764802YX | dla land and maritime | microcircuit memory | RFQ |
| 5962-8764802YA | dla land and maritime | microcircuit memory | RFQ |
| AT27C512R-20LM 883 | atmel corporation | microcircuit memory | RFQ |
| AS57C512-20ECM | austin semiconductor inc | microcircuit memory | RFQ |
| 5962-8764802BYA | dla land and maritime | microcircuit memory | RFQ |
| 77A110867P001 | lockheed martin corporation | microcircuit memory | RFQ |
| SL127 | atmel corporation | microcircuit memory | RFQ |
| AT27C512 20LM 88 | atmel corporation | microcircuit memory | RFQ |
| 5962-8764802BYB | dla land and maritime | microcircuit memory | RFQ |
| 27C512 20MR K | microchip technology incorporated | microcircuit memory | RFQ |
| SMJ27C512-FM | texas instruments inc | microcircuit memory | RFQ |
| AM27C512-200 BUA | advanced micro devices inc | microcircuit memory | RFQ |
| 5962-8764802BYX | dla land and maritime | microcircuit memory | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| AEHX | MAXIMUM POWER DISSIPATION RATING | 350.0 MILLIWATTS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 60.00 MILLIAMPERES MAXIMUM SUPPLY |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | EPROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-12 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| Relevant Components for NSN - 5962-01-333-2528, 5962013332528 | ||||
| 5998-01-628-9128 (5998016289128) | 5950-00-556-2628 (5950005562628) | 5910-00-502-7030 (5910005027030) | 5930-01-200-1187 (5930012001187) | |
| 5930-00-436-0040 (5930004360040) | 5998-01-022-6777 (5998010226777) | 5999-01-229-2868 (5999012292868) | 5930-00-451-8223 (5930004518223) | |
| 5980-01-237-3545 (5980012373545) | 5955-00-463-6952 (5955004636952) | 5975-01-438-5116 (5975014385116) | 5998-01-391-1476 (5998013911476) | |
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