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| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-333-3430 (013333430) |
| NCB Code | USA (01) |
| Manufacturer | Dla Land And Maritime, Atmel Corporation, Microchip Technology Incorporated, Truong Investment Llc, Advanced Micro Devices Inc, Raytheon Company, Thales Defense And Security Inc, Intel Corporation, Waferscale Integration Inc, Northrop Grumman Systems Corporation, Austin Semiconductor Inc |
| Part Number | Manufacturer | Item Name | RFQ |
|---|---|---|---|
| 5962-8764801BXB | dla land and maritime | microcircuit memory | RFQ |
| 5962-8764801BXX | dla land and maritime | microcircuit memory | RFQ |
| AT27C512R 15DM 883 | atmel corporation | microcircuit memory | RFQ |
| 5962-8764801XB | dla land and maritime | microcircuit memory | RFQ |
| 5962-8764801BXA | dla land and maritime | microcircuit memory | RFQ |
| 5962-8764801XX | dla land and maritime | microcircuit memory | RFQ |
| 27C512-15MR J | microchip technology incorporated | microcircuit memory | RFQ |
| AT27C512-15DC | truong investment llc | microcircuit memory | RFQ |
| AM27C512 150 BXA | advanced micro devices inc | microcircuit memory | RFQ |
| G528349-103 | raytheon company | microcircuit memory | RFQ |
| 115721-0001 | thales defense and security inc | microcircuit memory | RFQ |
| G330510-303 | raytheon company | microcircuit memory | RFQ |
| AT27C512R-15DC | atmel corporation | microcircuit memory | RFQ |
| MD27C512-15 B | intel corporation | microcircuit memory | RFQ |
| 5962-87648 | dla land and maritime | microcircuit memory | RFQ |
| WS27C512L-15DMB | waferscale integration inc | microcircuit memory | RFQ |
| 5962-8764801XA | dla land and maritime | microcircuit memory | RFQ |
| 5A12318H03 | northrop grumman systems corporation | microcircuit memory | RFQ |
| SMJ27C512-25JM | austin semiconductor inc | microcircuit memory | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| ADAQ | BODY LENGTH | 1.490 INCHES MAXIMUM |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| ABKW | OVERALL HEIGHT | 0.357 INCHES MINIMUM AND 0.432 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 350.0 MILLIWATTS |
| CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 60.00 MILLIAMPERES MAXIMUM SUPPLY |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | EPROM |
| Relevant Components for NSN - 5962-01-333-3430, 5962013333430 | ||||
| 5998-01-628-9128 (5998016289128) | 5950-00-556-2628 (5950005562628) | 5910-00-502-7030 (5910005027030) | 5930-01-200-1187 (5930012001187) | |
| 5930-00-436-0040 (5930004360040) | 5998-01-022-6777 (5998010226777) | 5999-01-229-2868 (5999012292868) | 5930-00-451-8223 (5930004518223) | |
| 5980-01-237-3545 (5980012373545) | 5955-00-463-6952 (5955004636952) | 5975-01-438-5116 (5975014385116) | 5998-01-391-1476 (5998013911476) | |
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