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| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-339-7104 (013397104) |
| NCB Code | USA (01) |
| Manufacturer | Dla Land And Maritime, General Dynamics Land Systems Inc, Rockwell Collins Aerospace, Mmi Amd, Cypress Semiconductor Inc |
| Part Number | Manufacturer | Item Name | RFQ |
|---|---|---|---|
| 5962-8867002LA | dla land and maritime | microcircuit memory | RFQ |
| 7573733-300 | general dynamics land systems inc | microcircuit memory | RFQ |
| 351-5866-012 | rockwell collins aerospace | microcircuit memory | RFQ |
| PALC22V10H-30MJS883B | mmi amd | microcircuit memory | RFQ |
| 5962-88670 | dla land and maritime | microcircuit memory | RFQ |
| PALC22V10-30DMB | cypress semiconductor inc | microcircuit memory | RFQ |
| 391-0351-032 | rockwell collins aerospace | microcircuit memory | RFQ |
| 5962-8867002LX | dla land and maritime | microcircuit memory | RFQ |
| 5962-8867002LB | dla land and maritime | microcircuit memory | RFQ |
| ROM PROM HEAD 264 | dla land and maritime | microcircuit memory | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM ACCESS |
| ADAQ | BODY LENGTH | 1.280 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMED AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 16.00 MILLIAMPERES FORWARD CURRENT,NONREPETITIVE,MAXIMUM PEAK TOTAL VALUE NOMINAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | AND-OR LOGIC ARRAY |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | PAL |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| Relevant Components for NSN - 5962-01-339-7104, 5962013397104 | ||||
| 5998-01-628-9128 (5998016289128) | 5950-00-556-2628 (5950005562628) | 5910-00-502-7030 (5910005027030) | 5930-01-200-1187 (5930012001187) | |
| 5930-00-436-0040 (5930004360040) | 5998-01-022-6777 (5998010226777) | 5999-01-229-2868 (5999012292868) | 5930-00-451-8223 (5930004518223) | |
| 5980-01-237-3545 (5980012373545) | 5955-00-463-6952 (5955004636952) | 5975-01-438-5116 (5975014385116) | 5998-01-391-1476 (5998013911476) | |
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