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| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-447-2495 (014472495) |
| NCB Code | USA (01) |
| Manufacturer | Honeywell International Inc, White Electronic Designs Corpora, Cypress Semiconductor Inc, Dla Land And Maritime, Austin Semiconductor Inc |
| Part Number | Manufacturer | Item Name | RFQ |
|---|---|---|---|
| 8522733-701 | honeywell international inc | microcircuit memory | RFQ |
| 8522733-701 | white electronic designs corpora | microcircuit memory | RFQ |
| 8522733-701 | cypress semiconductor inc | microcircuit memory | RFQ |
| 5962-8959819MUA | dla land and maritime | microcircuit memory | RFQ |
| 8522733-701 | austin semiconductor inc | microcircuit memory | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT |
| AGAV | End Item Identification | F16AIRCOMBFIT |
| CZEQ | Time Rating Per Chacteristic | 35.00 NANOSECONDS NOMINAL ACCESS |
| CZER | Memory Device Type | RAM |
| AFJQ | Storage Temp Range | -65.0 TO 150.0 DEG CELSIUS |
| ADAT | Body Width | 0.392 INCHES MINIMUM AND 0.408 INCHES MAXIMUM |
| CWSG | Terminal Surface Treatment | SOLDER |
| TTQY | Terminal Type And Quantity | 32 LEADLESS |
| CBBL | Features Provided | MONOLITHIC AND ELECTROSTATIC SENSITIVE AND LOW POWER AND BURN IN, MIL-STD-883, CLASS B |
| FEAT | Special Features | SELECTION CRITERIA BASED ON DATA RETENTION CURRENT (ICC4),PER 3.2 OF DRAWING |
| MRC | Decoded Requirement | Clear Text Reply |
| CXCY | Part Name Assigned By Controlling Agency | MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 128K X 8 STATIC RANDOM ACCESS MEMORY (SRAM) LOW POWER, DUAL CE |
| ADAQ | Body Length | 0.800 INCHES MINIMUM AND 0.840 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 1.0 WATTS |
| ADAU | Body Height | 0.080 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CQSZ | Inclosure Configuration | LEADLESS FLAT PACK |
| AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| Relevant Components for NSN - 5962-01-447-2495, 5962014472495 | ||||
| 5998-01-628-9128 (5998016289128) | 5950-00-556-2628 (5950005562628) | 5910-00-502-7030 (5910005027030) | 5930-01-200-1187 (5930012001187) | |
| 5930-00-436-0040 (5930004360040) | 5998-01-022-6777 (5998010226777) | 5999-01-229-2868 (5999012292868) | 5930-00-451-8223 (5930004518223) | |
| 5980-01-237-3545 (5980012373545) | 5955-00-463-6952 (5955004636952) | 5975-01-438-5116 (5975014385116) | 5998-01-391-1476 (5998013911476) | |
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