Request a Competitive Quote for Part Number HSMP-3830T30 with NSN 5961013561387 by Hewlett-Packard Company!

Part Number: HSMP-3830T30

Alternate P/N: HSMP3830T30

Manufacturer: Hewlett-Packard Company

NSN: 5961-01-356-1387

NIIN: 013561387

Item Name : Semiconductor Device Diode

CAGE Code: 28480

FSC: 5961 Semiconductor Devices and Associated Hardware

FSG: 59 Electrical and Electronic Equipment Components

Country: USA

NCB Code: 01

Thank you for taking an interest in the top-caliber NSN products we feature here on AI NSN Parts. On this page, you can submit a quote request for part number HSMP-3830T30, a Semiconductor Device Diode item that is manufactured by Hewlett-Packard Company. Listed alongside the NSN 5961013561387 within our database, part number HSMP-3830T30 is conveniently ready for purchase at any time.

Product Details

“*” Required Fields Are Compulsory

Contact Information

* By clicking this box, I acknowledge that I have read and accept the ASAP Semiconductor Terms and Conditions and agree that all quotes and purchase orders are exclusively subject to the ASAP Semiconductor Customer Terms and Conditions.

I consent to receive email communications from ASAP Semiconductor and can unsubscribe at any time.
ASAP Semiconductor is a wholly independent aftermarket parts distributor.
This website is intended for quotations based on part numbers only. Please DO NOT submit drawings, technical data, or other specifications through this portal.

Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.

Note : We Will Not Share Your Information To Any Third Parties.

Upload RFQ SHEET

If you have more than one item, upload your spreadsheet here

Upload File

To ensure listings like part number HSMP-3830T30 are ready for swift installation, we have a rigorous quality assurance program in place. As such, we make it easy for you to inquire about popular NSNs like 5961-01-356-1387, as well as the many other Hewlett-Packard Company products produced under CAGE Code 28480 that interest you. For the benefit of our customers, we carefully vet every entity that we source from, guaranteeing that you only receive superior-caliber offerings in every order. With these dedications, you can always purchase from us with confidence. Furthermore, we also organize our stock based on Federal Supply Classes, so you can find popular items under FSCs like 5961 Semiconductor Devices and Associated Hardware. Do not hesitate to submit the RFQ form below, and within 15 minutes or less of submission, one of our experts will reach out with a customized solution. Get started today and see why so many customers steadily depend on AI NSN Parts for their operational needs.

NSN Information for Part Number HSMP-3830T30 with NSN 5961-01-356-1387, 5961013561387

NSN	FSC	NIIN	CLS	Hazmat	DEMIL	Cancelled NSN
5961-01-356-1387 Item PartTypeName: SEMICONDUCTOR DEVICE,DIODE	5961	013561387	0	N	B
	CIIC	HCC	ESD	PMIC	Criticality	ENAC
	U		B	A	0
Part Number	ISC	RNVC	RNCC	HCC	MSDS	SADC
1900-0096	2	9	5

Characteristics Data of NSN 5961-01-356-1387, 5961013561387

MRC	Criteria	Characteristic
AGAV	END ITEM IDENTIFICATION	NIMITZ CLASS CVN; SEAWOLF CLASS SSN; LOS ANGELES CLASS SSN (688); TICONDEROGA CLASS CG (47); SPRUANCE CLASS DD (963); OLIVER PERRY CLASS FFG; FORRESTAL CLASS CV; ARLEIGH BURKE CLASS DDG; LANDING CRAFT AIR CUSHION (LCAC)
CTSG	MAXIMUM OPERATING TEMP PER MEASUREMENT POINT	25.0 DEG CELSIUS AMBIENT AIR
FEAT	SPECIAL FEATURES	WEAPON SYSTEM ESSENTIAL; JUNCTION PATTERN ARRANGEMENT: PIN
MATT	MATERIAL	PLASTIC INCLOSURE
MATT	MATERIAL	SILICON SEMICONDUCTOR
TTQY	TERMINAL TYPE AND QUANTITY	3 TAB,SOLDER LUG
ABHP	OVERALL LENGTH	0.125 INCHES NOMINAL
AXGY	MOUNTING METHOD	TERMINAL
CRTL	CRITICALITY CODE JUSTIFICATION	FEAT
CTQN	VOLTAGE RATING IN VOLTS PER CHARACTERISTIC	1.0 MAXIMUM FORWARD VOLTAGE,DC
CTQX	CURRENT RATING PER CHARACTERISTIC	100.00 NANOAMPERES MAXIMUM REVERSE CURRENT,DC
CTRD	POWER RATING PER CHARACTERISTIC	250.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION
ABMK	OVERALL WIDTH	0.150 INCHES NOMINAL
ABJT	TERMINAL LENGTH	0.044 INCHES NOMINAL
ABKW	OVERALL HEIGHT	0.060 INCHES NOMINAL
AFZC	FUNCTION FOR WHICH DESIGNED	MICROWAVE
ALAZ	JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION	T0-236